TECHNOLOGIES FOR MEMORY AND POWER COMPONENTS EMBEDDED IN A SUBSTRATE CORE

Abstract: technologies for memory and power components embedded in a substrate core are disclosed. in one embodiment, memory components such as a high-bandwidth memory stack and power components such as deep trench capacitors are disposed in a cavity defined in a substrate core for a circuit board of an integrated circuit package, such as a processor. the components are stacked on top of each other, allowing for the stack of components to match the height of the substrate core, even when the height of the individual components is less than the height of the substrate core. configuring the memory and power components in this manner can provide mechanical stability to the power components and substrate core and provide close access to memory and power for a semiconductor die mounted on the circuit board.

Inventor(s): Whitney M. Bryks, Dilan Seneviratne, Mahdi Mohammadighaleni, Yosef Kornbluth, Joshua J. Stacey

CPC Classification: H01L25/18 (the devices being of types provided for in two or more different subgroups of the same main group of groups - , or in a single subclass of ,)

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