PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

Abstract: a semiconductor structure includes a first die, a dielectric layer, a second interconnection structure, a second conductive pad and a conductive feature. the first die includes a first interconnection structure over a first substrate and a first conductive pad disposed on and electrically connected to the first interconnection structure. the first conductive pad has a probe mark on a surface thereof. the dielectric layer laterally warps around the first die. the second interconnection structure is disposed on the first die and the dielectric layer, the second interconnection structure includes a conductive via landing on the first conductive pad of the first die, and the conductive via is spaced apart from the first probe mark. the second conductive pad is disposed on and electrically connected to the second interconnection structure. the conductive feature is disposed on the second conductive pad.

Inventor(s): Ming-Fa Chen, Hsien-Wei Chen, Sung-Feng Yeh

CPC Classification: H01L25/0655 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (use of semiconductor devices for measuring ; resistors in general ; magnets, inductors or transformers ; capacitors in general ; electrolytic devices ; batteries or accumulators ; waveguides, resonators or lines of the waveguide type ; line connectors or current collectors ; stimulated-emission devices ; electromechanical resonators ; loudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers ; electric light sources in general ; printed circuits, hybrid circuits, casings or constructional details of electrical apparatus, manufacture of assemblages of electrical components ; use of semiconductor devices in circuits having a particular application, see the subclass for the application))

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