CONNECTING STRUCTURE

Abstract: a connecting structure includes a first substrate having a plurality of first electrodes arranged in a plane direction; a second substrate having a plurality of second electrodes arranged in the plane direction and disposed at a spaced interval with respect to the first substrate in a thickness direction perpendicular to the plane direction so that the first electrode faces the second electrode; and an adhesive layer interposed between the first substrate and the second substrate, electrically connecting the first electrode and the second electrode facing each other in the thickness direction, and adhering the first substrate to the second substrate. a thickness of the adhesive layer is below 15 �m. a distance a between the first electrodes adjacent to each other in the plane direction is longer than a distance b between the first electrode and the second electrode facing each other in the thickness direction.

Inventor(s): Masatoshi KATO, Tsubasa OMURA, Yuichiro SHISHIDO, Naofumi KOSAKA

CPC Classification: H01L24/29 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (use of semiconductor devices for measuring ; resistors in general ; magnets, inductors or transformers ; capacitors in general ; electrolytic devices ; batteries or accumulators ; waveguides, resonators or lines of the waveguide type ; line connectors or current collectors ; stimulated-emission devices ; electromechanical resonators ; loudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers ; electric light sources in general ; printed circuits, hybrid circuits, casings or constructional details of electrical apparatus, manufacture of assemblages of electrical components ; use of semiconductor devices in circuits having a particular application, see the subclass for the application))

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