SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME

Abstract: a method for making a semiconductor device is provided. the method includes providing a package base; attaching a first interposer layer on the package base via solder bumps; attaching a first semiconductor die on the package base and adjacent to the first interposer layer; attaching a second interposer layer on the first interposer layer via solder bumps to form an interposer stack, wherein the first interposer layer and the second interposer layer define a step structure, wherein the step structure comprises two step surfaces extending from the first interposer layer and the second interposer layer on the side of the interposer stack, respectively; attaching a second semiconductor die on both of the first semiconductor die and the first interposer layer; and forming a first encapsulant layer on the package base to encapsulate the first interposer layer, the second interposer layer, the first semiconductor die, and the second semiconductor die.

Inventor(s): JongTae KIM, HangChul CHOI, NamJu CHO

CPC Classification: H01L24/16 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (use of semiconductor devices for measuring ; resistors in general ; magnets, inductors or transformers ; capacitors in general ; electrolytic devices ; batteries or accumulators ; waveguides, resonators or lines of the waveguide type ; line connectors or current collectors ; stimulated-emission devices ; electromechanical resonators ; loudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers ; electric light sources in general ; printed circuits, hybrid circuits, casings or constructional details of electrical apparatus, manufacture of assemblages of electrical components ; use of semiconductor devices in circuits having a particular application, see the subclass for the application))

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