PRESS PACK POWER SEMICONDUCTOR DEVICE WITH LOCATOR STRIP

Abstract: a press pack power semiconductor device can include a housing, a semiconductor, and a locator strip deformed into a ring-like shape to concentrically fit within the housing and concentrically locate at least part of the semiconductor therein. the locator strip can include a first plurality of regions regularly interspersed with a second plurality of regions along a length of the locator strip, and each of the first plurality of regions can have a first cross-sectional area that can be smaller than a second cross-sectional area of each of the second plurality of regions.

Inventor(s): Thomas Spann, Joseph Geo

CPC Classification: H01L23/544 (Marks applied to semiconductor devices {or parts}, e.g. registration marks, {alignment structures, wafer maps (test patterns for characterising or monitoring manufacturing processes )})

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