SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND MODULE

Abstract: there is provided a semiconductor device including: a lead frame including a first opening portion; a resin filled in the first opening portion; and a semiconductor element electrically connected to the lead frame, wherein a side wall surface of the lead frame in the first opening portion has a larger average surface roughness than an upper surface of the lead frame.

Inventor(s): Bin ZHANG, Akinori NII, Taro NISHIOKA

CPC Classification: H01L23/49861 ({Lead-frames fixed on or encapsulated in insulating substrates (, take precedence)})

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