THERMALLY CONDUCTIVE SUPPORT AND ASSEMBLY COMPRISING A THERMALLY CONDUCTIVE SUPPORT AND A PACKAGED POWER DEVICE

Abstract: various embodiments of thermally conductive support are provided. an example thermally conductive support includes a core layer, of metal, a dielectric layer, extending on a first face of the core layer and an electrical connection layer, of electrically conductive material, extending on the first dielectric layer. the dielectric layer has a through hole which exposes the core layer and is intended to be filled with an adhesive mass having an electronic power device adhering thereto, forming a device/support assembly.

Inventor(s): Cristiano Gianluca STELLA, Francesco SALAMONE, Marco PAPASERIO

CPC Classification: H01L23/49861 ({Lead-frames fixed on or encapsulated in insulating substrates (, take precedence)})

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