APPARATUS FORMED FROM ELECTRONIC COMPONENTS HAVING DIFFERENT RESPECTIVE THICKNESSES AND METHODS OF FORMING AN APPARATUS FROM ELECTRONIC COMPONENTS HAVING DIFFERENT RESPECTIVE THICKNESSES

Abstract: an apparatus includes a pair of substrates with conductive material formed on portions of inwardly facing surfaces thereof, and a step formed in or on the conductive material on one of the pair of substrates. a lead frame having leads and electronic components having different respective thicknesses are mounted between the conductive materials on the pair of substrates. the step has a step thickness dimensioned to facilitate electrical contact between a thickest one of the electronic components or the leads with the step in the conductive material on one of the pair of substrates and the conductive material on the one other of the pair of substrates. an electrical signal path is formed between the electronic components or the leads disposed in electrical contact with the step and the conductive material on the one other of the pair of substrates.

Inventor(s): Mankit Lam

CPC Classification: H01L23/49861 ({Lead-frames fixed on or encapsulated in insulating substrates (, take precedence)})

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