CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE HAVING THE SAME

Abstract: a circuit board according to an embodiment comprises a build-up structure including a plurality of insulating layers stacked along a vertical direction; a protective layer disposed on the build-up structure; and a plurality of insulating members disposed on the protective layer and spaced apart from each other.

Inventor(s): Su Min LEE, Dae Young KU, Ji Hoon KIM, Dae Sung MOON, Byung Wook WOO, Chang Woo YOO, Sang Hyun LEE, Ju Hyun LEE

CPC Classification: H01L23/49822 ({Multilayer substrates (multilayer metallisation on monolayer substrate )})

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