POLYMER HYBRID BONDING FOR COMPOSITE PACKAGES AND METHODS OF FORMING THE SAME

Abstract: a bonded assembly includes a first package structure including first metallic bump structures and a first polymer bonding layer laterally surrounding the first metallic bump structures; a second package structure including second metallic bump structures and a second polymer bonding layer laterally surrounding the second metallic bump structures; and solder material portions located between the first metallic bump structures and the second metallic bump structures. each of the solder material portions is bonded to a respective one of the first metallic bump structures and a respective one of the second metallic bump structures, and the second polymer bonding layer is bonded to the first polymer bonding layer through polymer-to-polymer bonding.

Inventor(s): Tzuan-Horng Liu, An-Jhih Su

CPC Classification: H01L23/49811 ({Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads ( takes precedence)})

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