INTEGRATED CIRCUIT PACKAGES AND METHODS

Abstract: an integrated circuit package and the method of forming the same are provided. the integrated circuit package may comprise a substrate, a first package component bonded to the substrate and a first cooling system over the first package component. the first package component may comprise a first semiconductor die. the first cooling system may comprise a first base over the first package component, wherein the first base may comprise a first recess, a first pin protruding from a bottom of the first recess, and a first raised portion encircling the recess in a top-down view; a lid over the first base, wherein the lid may be spaced apart from the first pin; and a sealant connecting the lid to the first raised portion of the first base.

Inventor(s): Yu-Jen Lien, Cheng-Chieh Hsieh, Chen-Hua Yu, Ke-Han Shen, Hung-Yi Kuo

CPC Classification: H01L23/3672 ({Foil-like cooling fins or heat sinks (being part of lead-frames )})

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