WAFER BONDING APPARATUS

Abstract: provided is a wafer bonding apparatus including a first chuck configured to suction a first wafer on a first surface of the first chuck, a second chuck configured to suction a second wafer on a second surface of the second wafer that faces the first surface of the first chuck, a plurality of bonding pin members in the second chuck in a direction parallel to the second surface of the second chuck, the plurality of bonding pin members being configured to be individually operable, and a plurality of drivers connected to the plurality of bonding pin members, respectively, the plurality of drivers being configured to move the connected plurality of bonding pin members, respectively, in a first direction perpendicular to the second surface of the second chuck, wherein the second chuck includes a plurality of vacuum regions adjacent to the plurality of bonding pin members, respectively.

Inventor(s): Sangjun Park, Taehong Min, Jaeho Hong, Bongcheol Kim, Sangho Yun

CPC Classification: H01L21/6835 ({using temporarily an auxiliary support})

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