METHODS OF ADJUSTING A TILT BETWEEN A BONDING TOOL ASSEMBLY AND A SUPPORT STRUCTURE ASSEMBLY OF A BONDING SYSTEM, AND RELATED BONDING SYSTEMS

Abstract: a bonding system for bonding a semiconductor element to a substrate is provided. the bonding system includes a bonding tool assembly for bonding a semiconductor element to a substrate. the bonding system also includes a support structure assembly for supporting the substrate. the bonding system further includes a vacuum sensor for sensing a vacuum leakage at an interface between the bonding tool assembly and the support structure assembly during contact therebetween. the vacuum sensor is also used in connection with a tilt adjustment between the bonding tool assembly and the support structure assembly.

Inventor(s): Matthew Tarabulski

CPC Classification: H01L21/68 (for positioning, orientation or alignment)

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