20250218832. Substrate Process (Kokusai Electric)
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM AND SUBSTRATE RETAINER ASSEMBLY
Abstract: it is possible to prevent the substrate from sticking to the substrate support when forming the film. there is provided a technique that includes: a primary boat provided with first support structures; a process vessel; second support structures vertically movable; a rotator provided with a rotation shaft; and a driver for lifting one or more substrates apart from the first support structures by elevating the second support structures upward. the driver includes: a linear motion shaft; a transmission structure for transmitting a linear motion of the linear motion shaft to the second support structures; and an actuator for lifting a lower surface of the linear motion shaft in the axial direction. the actuator and the lower surface of the linear motion shaft are spaced apart from each other when an upward force is not applied by the actuator onto the lower surface of the linear motion shaft.
Inventor(s): Tatsuya NISHINO, Yukinori ABURATANI
CPC Classification: H01L21/67309 (using specially adapted carriers {or holders; Fixing the workpieces on such carriers or holders (holders for supporting a complete device in operation )})
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