SUBSTRATE PROCESSING APPARATUS

Abstract: proposed is a substrate processing apparatus including a process chamber configured to provide a substrate processing space, a substrate chuck configured to support a substrate in the substrate processing space, have a heater, and control temperature of the substrate, and a chuck temperature control unit configured to divide the substrate chuck into a plurality of heating areas and regulate temperature of the substrate chuck by heating area through heat absorption, heat shielding, and cooling.

Inventor(s): Jae Woo KIM

CPC Classification: H01L21/67248 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se , , ; simple temporary support means, e.g. using adhesives, electric or magnetic means , ; apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto ;)})

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