NON-PLANAR SEMICONDUCTOR PACKAGING SYSTEMS AND RELATED METHODS

Abstract: implementations of a packaging system may include a wafer; and a curvature adjustment structure coupled thereto where the curvature adjustment structure may be configured to alter a curvature of a largest planar surface of the wafer.

Inventor(s): Michael J. SEDDON, Francis J. CARNEY

CPC Classification: H01L21/67092 ({Apparatus for mechanical treatment (or grinding or cutting, see the relevant groups in subclasses or )})

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