APPARATUS OF PROCESSING A SUBSTRATE

Abstract: the present invention relates to an apparatus of processing a substrate, in more detail, an apparatus of processing a substrate, the apparatus being able to separately discharge gas produced during substrate treatment. an object is to provide an apparatus of processing a substrate that can separately discharge gases simultaneously with treatment liquids and can provide uniform pressure in a plurality of exhaust baths.

Inventor(s): Cheol Yong SHIN, Jae Youl KIM, Sang Hoon KIM, Ho Jong HWANG, In Ki JUNG

CPC Classification: H01L21/67057 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se , , ; simple temporary support means, e.g. using adhesives, electric or magnetic means , ; apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto ;)})

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