APPARATUS FOR TREATING SUBSTRATE

Abstract: the present invention provides an apparatus for treating a substrate. the apparatus for treating a substrate includes: a first treatment bath having a first accommodation space in which first treatment liquid is accommodated, and performing liquid treatment on a plurality of sheets of substrates; a second treatment bath having a second accommodation space in which second treatment liquid is accommodated, and performing liquid treatment on the plurality of sheets of substrates; a supporting unit fixedly installed in the second accommodation space; and a lifter unit transferring substrates between the first treatment bath and the second treatment bath, wherein the plurality of sheets of substrates is liquid-treated in a state in which the substrates are supported on the lifter unit in the first treatment bath, and the plurality of sheets of substrates is liquid-treated in a state in which the substrates are supported on the supporting unit in the second treatment bath.

Inventor(s): Seul Gi CHOI, Eun Jung LEE, Jun Hyun LIM, Hee Jun YOUN

CPC Classification: H01L21/67057 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se , , ; simple temporary support means, e.g. using adhesives, electric or magnetic means , ; apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto ;)})

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