SUBSTRATE DRYING APPARATUS AND SUBSTRATE DRYING METHOD

Abstract: a substrate drying apparatus includes a process chamber including a processing space for drying a residual liquid remaining on a surface of a substrate, a first fluid supply device configured to supply a first fluid to the processing space, wherein the solubility of the residual liquid in the first fluid is a first solubility, a second fluid supply device configured to supply a second fluid in a supercritical state to the processing space, wherein the solubility of the residual liquid in the second fluid is a second solubility that is greater than the first solubility, and an exhaust device configured to discharge a waste fluid within the processing space of the process chamber to the outside of the process chamber.

Inventor(s): Junho YOON, Jihoon JEONG, Taeheon KIM, Junho LEE, Younghoo KIM, Jongwon LEE, Jiwoong JUNG

CPC Classification: H01L21/67034 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se , , ; simple temporary support means, e.g. using adhesives, electric or magnetic means , ; apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto ;)})

Search for rejections for patent application number 20250218810