METHOD FOR MANUFACTURING ELECTRONIC COMPONENT OR SEMICONDUCTOR DEVICE

Abstract: provided is a new method by which it is easier to remove an element after processing, so as to improve productivity in manufacturing an electronic component or a semiconductor device. an object to be processed used in manufacturing an electronic component or a semiconductor device is attached to an uneven surface of a pressure sensitive adhesive layer. the object to be processed on the pressure sensitive adhesive layer is processed to obtain a processed product. the processed product is removed from the pressure sensitive adhesive layer.

Inventor(s): Kanako KONO, Taku NEMOTO, Satoshi KIDA, Kenta NISHIJIMA, Mutsumi MASUMOTO

CPC Classification: H01L21/568 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (use of semiconductor devices for measuring ; resistors in general ; magnets, inductors or transformers ; capacitors in general ; electrolytic devices ; batteries or accumulators ; waveguides, resonators or lines of the waveguide type ; line connectors or current collectors ; stimulated-emission devices ; electromechanical resonators ; loudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers ; electric light sources in general ; printed circuits, hybrid circuits, casings or constructional details of electrical apparatus, manufacture of assemblages of electrical components ; use of semiconductor devices in circuits having a particular application, see the subclass for the application))

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