SUBSTRATE PROCESSING APPARATUS, ELECTRODE ASSEMBLY, SUBSTRATE PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM

Abstract: there is provided a technique that includes: a process chamber in which a substrate is processed; a plurality of primary electrodes connected to a high frequency power supply provided outside the process chamber, wherein each of the plurality of primary electrodes is configured to be folded back at an upper portion thereof; and a secondary electrode to which a reference potential is applied.

Inventor(s): Tsuyoshi TAKEDA

CPC Classification: H01J37/32541 (Gas-filled discharge tubes (heating by discharge ))

Search for rejections for patent application number 20250218738