20250218720. Method Wafer Groundin (ASML Netherlands B.V.)
METHOD OF WAFER GROUNDING UTILIZING WAFER EDGE BACKSIDE COATING EXCLUSION AREA
Abstract: systems and methods are provided for grounding a wafer in a charged particle beam apparatus. the systems and methods include providing an exclusion area in a backside film on the wafer of sufficient size to allow an electrical connection between the wafer and an electrical contact of the charged particle beam apparatus. the systems and methods include contacting a pin body to a surface of the wafer, the wafer having a coating on the surface, and the pin body comprising a first tip and a second tip each extending from the pin body; wherein the contacting takes place at a first exclusion area of the coating by any one of the first tip, the second tip, or any combination thereof.
Inventor(s): Yinglong LI, Niels Johannes, Maria BOSCH, Jef GOOSSENS, Aimin WU, Humad ASGHAR, Tianming CHEN, Peter Paul HEMPENIUS, Xiang KE, Joan SANS MERCADER, Zhi ZHANG, Jan-Gerard Cornelis VAN DER TOORN
CPC Classification: H01J37/20 (Means for supporting or positioning the objects or the material; Means for adjusting diaphragms or lenses associated with the support {(introducing the objects )})
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- Patent Applications
- ASML Netherlands B.V.
- CPC H01J37/20
- Yinglong LI of San Jose CA US
- Niels Johannes, Maria BOSCH of Eindhoven NL
- Jef GOOSSENS of Bocholt BE
- Aimin WU of Milpitas CA US
- Humad ASGHAR of Milpitas CA US
- Tianming CHEN of San Jose CA US
- Peter Paul HEMPENIUS of Eindhoven NL
- Xiang KE of San Jose CA US
- Joan SANS MERCADER of Eindhoven NL
- Zhi ZHANG of San Jose CA US
- Jan-Gerard Cornelis VAN DER TOORN of Eindhoven NL