MULTILAYER ELECTRONIC COMPONENT

Abstract: a multilayer electronic component includes a body including a dielectric layer and internal electrodes disposed alternately with the dielectric layer, solder layers disposed on ends of the internal electrodes and each including a zn-based solder, and external electrodes disposed on the solder layer, wherein the solder layer includes a first alloy layer disposed on an interfacial surface with the internal electrode and including zn—ni alloy, and a second alloy layer disposed on an interfacial surface with the external electrode and including zn—cu alloy.

Inventor(s): Jin Hwan KIM, Ho In JUN, Kyo Sik KIM, Seung Hun BAEK, Chul Seung LEE

CPC Classification: H01G4/0085 (Fixed capacitors; Processes of their manufacture (electrolytic capacitors ))

Search for rejections for patent application number 20250218666