20250218500. Memory Array Connecti (Taiwan Semiconductor Manufacturing , .)
MEMORY ARRAY CONNECTIONS
Abstract: a device includes a substrate, a first sense amplifier disposed on the substrate, a first word line driver disposed on the substrate and situated adjacent the first sense amplifier in the x-direction, and a first memory array disposed above the first sense amplifier and above the first word line driver in the z-direction. a plurality of first conductive segments extend alternately in the x-direction and the y-direction, and are disposed between the first memory array and the first sense amplifier and configured to electrically connect the first sense amplifier to a first bit line of the first memory array. a plurality of second conductive segments extend alternately in the x-direction and the y-direction, and are disposed between the first memory array and the first word line driver and configured to electrically connect the first word line driver to a first word line of the first memory array.
Inventor(s): Chieh LEE, Chia-En Huang, Chun-Ying LEE, Yi-Ching LIU, Yih WANG, Hsiao Mei Tseng, Yao-Jen Yang, Jonathan Tsung-Yung Chang
CPC Classification: G11C11/4091 (Sense or sense/refresh amplifiers, or associated sense circuitry, e.g. for coupled bit-line precharging, equalising or isolating)
Search for rejections for patent application number 20250218500
- Patent Applications
- Taiwan Semiconductor Manufacturing Company, Ltd.
- CPC G11C11/4091
- Chieh LEE of Hsinchu TW
- Chia-En Huang of Xinfeng Township TW
- Chun-Ying LEE of Hsinchu TW
- Yi-Ching LIU of Hsinchu City TW
- Yih WANG of Hsinchu City TW
- Hsiao Mei Tseng of Hsinchu City TW
- Yao-Jen Yang of Hsinchu County TW
- Jonathan Tsung-Yung Chang of Hsinchu City TW