MATERIAL SELECTION ASSISTANCE APPARATUS, METHOD, AND PROGRAM

Abstract: a reception unit () receives shape values pertaining to the shapes of respective configurations of a semiconductor package, and physical property values of materials to use. each time the shape values and the physical property values are received, a simulation unit simulates warpage of a substrate on the basis of the received shape values and physical property values. a calculation unit () calculates, with regard to each of plural materials registered in a material database () in advance, the difference between physical property values of the plural materials and the received physical property value. a display control unit () displays simulation results and the results of calculating the difference in physical property values at a display device.

Inventor(s): Keita ABE, Atsuko UEDA, Mitsuki NAKATA

CPC Classification: G06F30/23 (using finite element methods [FEM] or finite difference methods [FDM])

Search for rejections for patent application number 20250217545