Resonant device improvement in PICs using spare devices to reduce power requirements

Abstract: the present disclosure relates to systems and methods for resonant device improvement in photonic integrated circuits using ring-and-disk microstructures with at least one spare device. by employing an in-service handoff procedure, the spare device is unlocked, spectrally aligned, and then seamlessly takes over from an operational device as temperature changes degrade the existing device's resonance alignment. this approach eliminates the need for wide-range thermal stabilization. instead, a limited electro-optic or thermo-optic tuning range is used, drastically reducing power consumption, especially in co-packaged optical input-output (io) systems. the ring-and-disk microstructures can be configured as receiver drop filters for demultiplexing or as transmitter modulators for encoding data. the approach supports high data rates by summing photocurrents or modifying coupling coefficients to achieve continuous, hitless operation. the result is a more energy-efficient, flexible optical design well-suited for next-generation integrated photonics, reducing the footprint, heat load, complexity, and overall costs significantly for large-scale deployments.

Inventor(s): Michael Y. Frankel, Vladimir Pelekhaty, Sadok Aouini

CPC Classification: G02B6/12007 (of the integrated circuit kind (electric integrated circuits ))

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