TEST DEVICE FOR OPTOELECTRONIC INTEGRATED CIRCUIT BEFORE BEING CO-PACKAGED

Abstract: a test device for an optoelectronic integrated circuit before being co-packaged includes a first jig, a first optical transmission assembly, a second optical transmission assembly, an interposer, a test load board, and a second jig. the first jig and the second jig are arranged up and down in a direction perpendicular to the test load board. a first photonic die and a second electronic integrated circuit are arranged in an accommodation space of the first jig. a first electronic integrated circuit is disposed in a groove portion of the second jig. a first signal transmission loop is formed between the test load board, the first electronic integrated circuit, the first photonic die, and the second photonic die. a second signal transmission loop is formed between the test load board, the first electronic integrated circuit, the interposer, and the second electronic integrated circuit.

Inventor(s): Jhih-hong CHENG, Jia-yu HSU

CPC Classification: G01R31/2896 ({Testing of IC packages; Test features related to IC packages (containers per se , encapsulations per se )})

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