INSPECTION APPARATUS AND INSPECTION METHOD

Abstract: an inspection apparatus includes: an imaging apparatus that is disposed above an aluminum wire and captures an image of the aluminum wire in order to obtain two-dimensional position information of the aluminum wire; a coaxial illuminator that is disposed coaxially with the imaging apparatus and applies coaxial illumination light to the aluminum wire; and a control apparatus that obtains, from the image, two-dimensional position information of a region existing on a vertex portion of the aluminum wire and having brighter luminance than a surrounding area and a region existing on a wire bonding portion, which is a bonding portion of the aluminum wire, and having brighter luminance than a surrounding area.

Inventor(s): Hiroshi UEDA, Tatsunori YANAGIMOTO, Yoshihisa UCHIDA, Hiroshi IWANAGA

CPC Classification: G01N21/9501 ({Semiconductor wafers (manufacturing processes per se of semiconductor devices implementing a measuring step )})

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