Jump to content

20250215320. Etching Method Plas (Tokyo Electron Limited)

From WikiPatents

ETCHING METHOD AND PLASMA PROCESSING APPARATUS

Abstract: a technique of improving an etching shape is provided.

Inventor(s): Ryo MATSUBARA, Yusuke TAKINO, Maju TOMURA

CPC Classification: C09K13/08 (MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE)

Search for rejections for patent application number 20250215320


Cookies help us deliver our services. By using our services, you agree to our use of cookies.