ETCHING COMPOSITION, ETCHING METHOD USING SAME, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

Abstract: an etching composition which selectively removes an etching target, the etching composition including an amine compound containing a tertiary amine, and an oxidizing agent. the etching composition may also contain at least one of an alkali compound, an organic solvent, water, a chelating agent, and a surfactant.

Inventor(s): Po Ting CHOU, Ming-Yen CHUNG

CPC Classification: C09K13/00 (Etching, surface-brightening or pickling compositions (for glass , {; for mortars, concrete, artificial or natural stone or ceramics } ; for metallic material , , ; {for semi-conductors }))

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