POLISHING COMPOSITION AND POLISHING METHOD USING THE SAME

Abstract: the present invention is to provide a means for improving a polishing removal rate of an object to be polished. there is provided a polishing composition containing: abrasive grains; a dispersing medium; and a water-soluble polymer, in which the abrasive grains are silica particles having an average particle size (d) of more than 1.0 �m and a circularity of primary particles of 0.90 or more, and a dispersion degree d of the abrasive grains is 2.0 or less.

Inventor(s): Ryo WAKABAYASHI

CPC Classification: C09G1/02 (POLISHING COMPOSITIONS (French polish ); SKI WAXES)

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