SLURRY COMPOSITION FOR CHEMICAL MECHANICAL POLISHING, METHOD OF PREPARING SAME, AND CHEMICAL MECHANICAL POLISHING METHOD OF WAFER

Abstract: provided are a slurry composition for chemical mechanical polishing including an abrasive including dendrimer particles surface-treated with metal oxide, a method of preparing same, and a chemical mechanical polishing method of a wafer.

Inventor(s): Seokhwan LEE, Inkwon KIM

CPC Classification: C09G1/02 (POLISHING COMPOSITIONS (French polish ); SKI WAXES)

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