Curable Composition

Abstract: a curable composition or thermal interface material, and the like can exhibit low adhesion force to a given adherend while exhibiting high thermal conductivity. also, the low adhesion force can be achieved without using an adhesion force adjusting component such as a plasticizer or in a state where the use ratio thereof is minimized. the curable composition can also exhibit a precisely controlled curing rate and simultaneously have excellent curability. a product may comprise the curable composition, or a cured body or thermal interface material thereof.

Inventor(s): Jeong Hyun Lee, Ho Yeon Son, Shin Hee Jun, Se Hoon Kim

CPC Classification: C08K5/37 (Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives ))

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