20250215172. Resin Molded (NATIONAL UNIVERSITY TOKAI NATIONAL HIGHER EDUCATION AND RESEARCH SYSTEM)
RESIN MOLDED BODY AND METHOD FOR PRODUCING THE SAME
Abstract: to provide a resin molded body having aln whiskers with excellent thermal conductivity, and a method for producing the same. the resin molded body includes at least, aln whiskers each having a fibrous aln single-crystal body having a surface and an oxygen-containing layer covering the surface of the fibrous aln single-crystal body, and a resin material, wherein a weight ratio of the aln whiskers is in a range of 3.0 wt % or more and 65.0 wt % or less.
Inventor(s): Toru UJIHARA, Kazuki OKUNO, Shiho OKADA, Shota WATANABE, Masaki MATSUMOTO
CPC Classification: C08J5/248 (Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs)
Search for rejections for patent application number 20250215172
- Patent Applications
- NATIONAL UNIVERSITY CORPORATION TOKAI NATIONAL HIGHER EDUCATION AND RESEARCH SYSTEM
- CPC C08J5/248
- Toru UJIHARA of Nagoya-shi, Aichi JP
- Kazuki OKUNO of Nagoya-shi, Aichi JP
- Shiho OKADA of Nagoya-shi, Aichi JP
- Shota WATANABE of Nagoya-shi, Aichi JP
- Masaki MATSUMOTO of Nagoya-shi, Aichi JP