METHOD OF TREATING SUBSTRATE

Abstract: disclosed is a method of treating a substrate, the method including: a substrate treating operation of treating a substrate with a component for treatment while moving an arm mounted with the component for treatment on the substrate rotating in accordance with a treatment recipe relative to the substrate; and a validating operation of validating an initial recipe received for use in the substrate treating operation prior to the substrate treating operation, in which the validating operation includes: a checking operation of partitioning a region on the substrate into a plurality of unit regions, and checking a treatment time during which each of the plurality of unit regions is directly treated by the component for treatment for a set time; and a determining operation of determining whether the treatment time in each of the plurality of unit regions checked in the checking operation is appropriate.

Inventor(s): Joon Ho WON, Hyeon Cheol LEE

CPC Classification: B08B13/00 (CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL (brushes ; devices for domestic or like cleaning ; {cleaning golf-clubs or golf accessories ; cleaning grips of bats on rackets } ; separation of particles from liquids or gases ; separation of solids , ; spraying or applying liquids or other fluent materials to surfaces in general ; cleaning devices for conveyors ; concurrent cleaning, filling and closing of bottles ; inhibiting corrosion or incrustation in general ; cleaning streets, permanent ways, beaches or land ; parts, details or accessories of swimming or splash baths or pools, specially adapted for cleaning ; preventing or removing electrostatic charges ))

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