PLATING APPARATUS AND PLATING METHOD

Abstract: a plating apparatus that allows shielding a specific portion of a substrate at a desired timing is achieved. the plating apparatus includes a plating tank for housing a plating solution, an anode arranged in the plating tank , a substrate holder for holding a substrate wf with a surface to be plated facing downward, a rotation mechanism for rotating the substrate holder , and a shielding mechanism moving a shielding member between the anode and the substrate wf depending on a rotation angle of the substrate holder

Inventor(s): Masaki TOMITA, Masaya SEKI, Masashi SHIMOYAMA, Shao Hua CHANG

CPC Classification: C25D17/008 ({Current shielding devices})

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