ADJUSTMENT METHOD AND SUBSTRATE PROCESSING APPARATUS

Abstract: a substrate processing apparatus includes: a stage having a placement surface; a processing container having a vertically-extending central axis and a cylindrical interior space in which the stage is disposed with a gap provided around the stage; a drive mechanism for moving the stage at least horizontally; and a sensor for measuring a width of the gap in a first horizontal direction intersecting the gap. an adjustment method includes: measuring widths of the gap at at least three locations on the stage by the sensor while moving the stage in a second horizontal direction perpendicular to the first horizontal direction by the drive mechanism; calculating a central position of the stage based on the widths of the gap measured at the at least three locations; and adjusting a horizontal position of the stage by the drive mechanism so that the central position of the stage is located on the central axis.

Inventor(s): Kiyoshi MORI

CPC Classification: C23C16/52 (Controlling or regulating the coating process {(, take precedence)})

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