FILM FORMATION METHOD AND FILM FORMATION DEVICE

Abstract: a film forming method includes the following (a) to (f). (a) preparing a substrate which has a first film and a second film in different regions on a surface thereof. (b) selectively forming a self-assembled monolayer (sam) on a surface of the second film using an organic compound that does not contain fluorine. (c) after (b), forming a protective film on a surface of the first film while inhibiting formation of the protective film on the surface of the second film using the sam. (d) after (c), fluorinating the sam and the protective film. (e) after (d), etching a fluorinated portion of the protective film. (f) after (e), forming a target film on a surface of the protective film or the surface of the first film while inhibiting the target film from being formed on the surface of the second film using the fluorinated sam.

Inventor(s): Tomohiro NAKAGAWA, Yumiko KAWANO, Toru USUKI, Shinichi IKE, Shuji AZUMO, Yusaku KASHIWAGI

CPC Classification: C23C16/042 (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion ; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. , ; metallising of glass ; metallising mortars, concrete, artificial stone, ceramics or natural stone ; enamelling of, or applying a vitreous layer to, metals ; treating metal surfaces or coating of metals by electrolysis or electrophoresis ; single-crystal film growth ; by metallising textiles ; decorating textiles by locally metallising ))

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