POLISHING COMPOSITION

Abstract: provided is a polishing composition that can offer a high-grade surface. the polishing composition contains silica particles (a), a basic compound (b), a first water-soluble polymer (c1), a second water-soluble polymer (c2), and water (d), wherein the first water-soluble polymer (c1) is a polyvinyl alcohol-based polymer. a product (er��) of an etching rate er [nm/h] of the polishing composition and zeta potential � [mv] of the polishing composition is −900 pmv/h or more and −90 pm v/h or less.

Inventor(s): Satoshi MOMOTA, Yukari KOMOTO, Taiki ICHITSUBO, Kohsuke TSUCHIYA

CPC Classification: C09K13/00 (Etching, surface-brightening or pickling compositions (for glass , {; for mortars, concrete, artificial or natural stone or ceramics } ; for metallic material , , ; {for semi-conductors }))

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