Moisture-curable Polyurethane Hot Melt Adhesive Composition

Abstract: the present invention provides a moisture-curable polyurethane hot melt adhesive composition comprising at least one polyurethane prepolymer obtained by reacting components comprising (a) a polyol mixture comprising: (a) at least one polyol which is liquid at room temperature, (b) at least one crystalline polyester polyol having a melting point of less than 70� c., and (c) 0 to less than 15.4% by weight based on the total amount of the composition of at least one crystalline polyester polyol having a melting point of no less than 70� c.; with (b) at least one polyisocyanate having at least two isocyanate groups in one molecule.

Inventor(s): YiZhong Luo

CPC Classification: C09J175/08 (ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine ))

Search for rejections for patent application number 20250207006