20250206949. (Nano and Advanced Materials Institute Limited)
HIGH DISPENSING RATE, HIGH THERMAL CONDUCTIVITY SILICONE THERMAL GEL WITH VERTICAL STABILITY AND NO CRACKING
Abstract: the present invention relates to a single-part thermal polysiloxane gel which demonstrates remarkable vertical stability, thermal conductivity, and rapid dispensing rate. the present invention is characterized by its polysiloxane polymer network formed by reaction of the components upon mixing, which enables embedding of thermally conductive fillers to further enhance the overall thermal conductivity of the gel, while not compromising in vertical stability. the thermal gel of the present invention is therefore highly suitable for application of electronics and electrical vehicle usage, which may involve high temperature and vertical positioning conditions.
Inventor(s): Xiaohua CHEN, Jinliang ZHAO, Chi Ho KWOK
CPC Classification: C08L83/06 (containing silicon bound to oxygen-containing groups ( takes precedence))
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