CONDENSATION-CURABLE SILICONE RESIN COMPOSITION AND DIE ATTACH MATERIAL FOR OPTICAL SEMICONDUCTOR APPARATUS

Abstract: a condensation-curable silicone resin composition that produces a resin cured product with high hardness, high resin strength and excellent adhesion capability with respect to substrates, including: (a) a polyorganosiloxane having hydroxyl group and hydrolysable group represented by formula (1), in an amount of 100 parts by mass, chsi(or)(oh)o(1); (b) an organosilicate oligomer, which is a partially hydrolyzed condensate of tetraalkyl orthosilicate, in an amount of 10 to 50 parts by mass relative to 100 parts by mass of the component (a); (c) a linear polyorganosiloxane having epoxy group and hydrosilyl group in the molecule represented by formula (2), in an amount of 0.1 to 10 parts by mass relative to 100 parts by mass of total of component (a) and component (b),

Inventor(s): Tsubasa NISHIMURA, Tatsuya YAMAZAKI

CPC Classification: C08L83/04 (COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers , ; artificial filaments or fibres ; textile treating compositions ))

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