20250206941. Resin Compositio (HUAWEI TECHNOLOGIES ., .)
RESIN COMPOSITION AND PREPARATION METHOD AND DISCLOSURE THEREOF
Abstract: embodiments of this disclosure provide a resin composition and a preparation method and an disclosure thereof. the resin composition includes epoxy resin, a curing agent, a curing accelerator, and an auxiliary agent, and the auxiliary agent includes a colorant and a toughening agent, where a total mass fraction of particles with particle sizes greater than 300 nm in the resin composition is less than or equal to 0.1 wt %. the resin composition has a good narrow-gap filling capability, and can ensure that a cured product of the resin composition has a good filling effect and has few air holes and particle impurities.
Inventor(s): Weina XU, Chengjie LIU, Teyi CHUANG
CPC Classification: C08L63/00 (Compositions of epoxy resins; Compositions of derivatives of epoxy resins)
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