Jump to content

20250206941. Resin Compositio (HUAWEI TECHNOLOGIES ., .)

From WikiPatents

RESIN COMPOSITION AND PREPARATION METHOD AND DISCLOSURE THEREOF

Abstract: embodiments of this disclosure provide a resin composition and a preparation method and an disclosure thereof. the resin composition includes epoxy resin, a curing agent, a curing accelerator, and an auxiliary agent, and the auxiliary agent includes a colorant and a toughening agent, where a total mass fraction of particles with particle sizes greater than 300 nm in the resin composition is less than or equal to 0.1 wt %. the resin composition has a good narrow-gap filling capability, and can ensure that a cured product of the resin composition has a good filling effect and has few air holes and particle impurities.

Inventor(s): Weina XU, Chengjie LIU, Teyi CHUANG

CPC Classification: C08L63/00 (Compositions of epoxy resins; Compositions of derivatives of epoxy resins)

Search for rejections for patent application number 20250206941


Cookies help us deliver our services. By using our services, you agree to our use of cookies.