RESIN COMPOSITION FOR DIE ATTACH FILM WITH EXCELLENT PERFORMANCE WITH LARGE DIE APPLICATIONS

Abstract: aspects of the disclosure relate to compositions for forming films and the use of the films in large die applications. in certain aspects, the disclosure relates to compositions comprising two or more resins, optionally, one or more inorganic fillers, and one or more core shell additives, together with a curative package, to films prepared from the disclosed compositions, and to cured films obtained after cure of the disclosed compositions. in certain aspects, cured films obtained after cure of the disclosed compositions have particular physical properties and/or combinations of physical properties.

Inventor(s): Jie Bai, Phuong U Do, Qizhuo Zhuo, Daniel M. Kwak, Hwang Kyu Yun

CPC Classification: C08L9/00 (Compositions of homopolymers or copolymers of conjugated diene hydrocarbons)

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