COPPER PARTICLE AND METHOD FOR PRODUCING SAME, PASTE COMPOSITION, SEMICONDUCTOR DEVICE, ELECTRICAL COMPONENT, AND ELECTRONIC COMPONENT

Abstract: a copper particle in which a ratio s()/s() of a crystallite diameter s() at a miller index () of copper to a crystallite diameter s() at a miller index () of copper in x-ray diffraction satisfies the following equation (1) or the following equation (2):

Inventor(s): Tomonao KIKUCHI, Kouki NONOMURA

CPC Classification: B23K35/302 (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal ; building up linings or coverings by casting ; casting by dipping ; manufacture of composite layers by sintering metal powder ; arrangements on machine tools for copying or controlling ; covering metals or covering materials with metals, not otherwise provided for ; burners ))

Search for rejections for patent application number 20250205831