ELEMENT SUBSTRATE AND LIQUID EJECTION HEAD

Abstract: an element substrate for a liquid ejection head that ejects liquid includes a heating resistor element configured to generate energy for ejecting liquid by generating heat, a wiring layer configured to supply electric power to the heating resistor element, and a connection member including a first connection portion connected to the heating resistor element and a plurality of second connection portions connected to the wiring layer, and configured to electrically connect the heating resistor element and the wiring layer. the connection member has branched end portions that extend, on a wiring layer side thereof, and is connected to the wiring layer by the plurality of the second connection portions.

Inventor(s): SHINYA IWAHASHI, TAKERU YASUDA, YUZURU ISHIDA, KOJI TAKASE

CPC Classification: B41J2/14072 ({Electrical connections, e.g. details on electrodes, connecting the chip to the outside...})

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