POLISHING PAD AND CHEMICAL MECHANICAL POLISHING APPARATUS

Abstract: a polishing pad and a chemical mechanical polishing apparatus are provided. the polishing pad includes: a central portion, designed with a central recess; and a peripheral portion surrounding the central portion, and designed with at least one peripheral recess. the at least one peripheral recess is disposed along an annulus contour. a lower part of the peripheral recess is greater than an upper part of the peripheral recess in terms of diameter area, and is different from the upper part in shape.

Inventor(s): Min-Hsun Lin, Yen-Jui Chu, Yu-Jen Lin

CPC Classification: B24B37/26 (characterised by the shape of the lapping pad surface, e.g. grooved)

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