SYSTEMS AND METHODS FOR PANEL POLISHING

Abstract: methods of manufacturing a semiconductor device are disclosed. the method includes providing a polygonal panel with a conductive layer. the method includes polishing an upper surface of the polygonal panel using a chemical polishing process.

Inventor(s): Christopher NETZBAND, Kiyotaka IMAI, Takenao NEMOTO, Tetsuo HIROSE, Ilseok SON

CPC Classification: B24B1/00 (Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes)

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