LASER SOLDERING METHOD USING DYNAMIC LIGHT SPOT

Abstract: a laser soldering method using dynamic light spot is provided and includes following steps: executing a soldering to control a laser module to radiate toward multi-lens to form a light spot on a soldering target; and, adjusting a lens distance between the multi-lens based on a spot-adjustment condition to adjust a light spot size of the light spot when the spot-adjustment condition is met in the soldering. the disclosure may provide multiple heating densities respectively adequate to different soldering status via adjusting the light spot size when using same laser power, so as to improve the soldering quality.

Inventor(s): Chun-Lien HUANG, Wen-Yu CHUANG, Keng-Ning CHANG, Ting-Yu LU, Chun-Fei KUNG

CPC Classification: B23K26/0665 (by using masks)

Search for rejections for patent application number 20250196260