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20250196257. Device Method Proces (TRUMPF Laser)

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DEVICE AND METHOD FOR PROCESSING A MATERIAL BY MEANS OF LASER PULSES THAT ARE INTRODUCED SPATIALLY STATISTICALLY AROUND A SPATIAL TARGET VALUE

Abstract: a method for processing a material by using laser pulses of a pulsed laser includes introducing the laser pulses into the material in order to process the material. the laser pulses are introduced into the material in a distributed manner spatially statistically around a spatial target value. a spatial statistical distribution of the laser pulses is capable of being adjusted and adapted according to a current feed rate.

Inventor(s): Daniel Großmann, Jonas Kleiner, Marc Sailer

CPC Classification: B23K26/0624 (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal ; building up linings or coverings by casting ; casting by dipping ; manufacture of composite layers by sintering metal powder ; arrangements on machine tools for copying or controlling ; covering metals or covering materials with metals, not otherwise provided for ; burners ))

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